| abstract |
The invention relates to a soft-hard combination process for a PCB board. A layer of microstrip line film is deposited on one side of the copper and soft board, and the uncopper surface of the hard board and the surface of the soft board without the microstrip line film are bonded together, and a layer of nano-glue is coated in the middle of the sandwich. Then put the whole into a vacuum chamber at 45-60℃ for pressing; use film to transfer the pattern on the copper sink surface, and use the etching process to etch the microstrip line circuit on the microstrip line film; electroplating a layer on the copper sink surface circuit Gold-nickel or tin layer, use NaOH solution to remove the anti-plating coating layer to expose the non-circuit copper layer, and use chemical reaction method to corrode the copper layer in non-circuit parts; use micro-engraving technology to remove microstrip line burrs, this scheme will soften The board and the hard board are combined, so that they can be used in different occasions and improve the adaptability of the PCB board. |