| abstract |
The present invention can reliably and easily hold a member to be treated when a mechanical or chemical treatment is performed on a member to be treated (such as a semiconductor wafer), and can provide the member to be treated (A) a peeling layer and (B) an adhesive layer for bonding a semiconductor device, wherein the peeling layer and the peeling layer are laminated in this order, Which is a layer containing a hydrocarbon resin. |