http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101452858-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e9258c4cb01189b8076cca72ecf73c55 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00721d2a65e67445bd4002931c20e795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_656f082477cce89cbeb2af0742a856e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57be14cb29148892a7481d1bc1e1e01c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38c128fcb73faa06cfa681c899d4b1da |
| publicationDate | 2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101452858-B1 |
| titleOfInvention | Method for manufacturing of photosensitive adhesive film using a epoxy group containing acrylic copolymer |
| abstract | The present invention relates to a process for producing a photosensitive adhesive film using an epoxy group-containing acrylic copolymer resin, wherein 30 to 40% by weight of an epoxy-containing acrylic copolymer, 5 to 15% by weight of a phenolic resin, 1 to 5% , A curing accelerator in an amount of 0.5 to 3 wt%, a compound having a hydroxyl group or a carboxyl group in an amount of 30 to 40 wt%, a radiation polymerizable compound in an amount of 10 to 20 wt%, and a photoinitiator in an amount of 0.5 to 3 wt% Applying and heating and drying the dissolvable or dispersed photosensitive adhesive on a support film of a polytetrafluoroethylene film or a polyethylene terephthalate film obtained by releasing a surface of the support, and drying the polyethylene terephthalate Thereby forming a photosensitive adhesive layer between the protective substrate film layers . Accordingly, in the method of patterning and bonding with the conventional epoxy adhesive, only the chip portion is patterned using the photosensitive adhesive film, whereby the silicon wafer and the glass substrate can be effectively bonded. |
| priorityDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.