| abstract |
The present invention provides a conductive adhesive film suitable for use, for example, as a circuit for bonding a semiconductor chip (particularly a power device) to an element-receiving portion of a lead frame or an insulating substrate, and a dicing die-bonding film using the same. A conductive bonding material on the electrode part, and a bonding layer that achieves lead-free and is excellent in both heat resistance and mounting reliability after bonding and sintering can be formed on the semiconductor chip and the element carrier part of the lead frame or insulating between the return electrodes of the substrate. The conductive adhesive film of the present invention contains metal particles (Q), resin (M), and at least one selected from the group consisting of predetermined organic phosphines (A) and predetermined sulfide-based compounds (B). The storage elastic modulus at 1 Hz measured in the state was 20 GPa or less, and the heating weight reduction rate when heated at 250° C. for 2 hours under a nitrogen atmosphere was less than 1%. |