| abstract |
The present invention provides a resin composition, an adhesive, a resin layer, a laminate film, and a wafer processed body using the resin composition, and a method for manufacturing electronic parts or semiconductor devices using them. The resin composition can form an electronic circuit into a substrate Or the semiconductor circuit forming substrate and the supporting substrate are bonded together, and the electronic circuit forming substrate or the semiconductor circuit forming substrate with a thickness of 1 μm or more and 100 μm or less has excellent heat resistance when it is bonded, and even through the manufacturing steps of electronic parts, semiconductor devices, etc., the adhesive force does not change. After that, it can be peeled off under mild conditions at room temperature. The present invention is a resin composition containing at least: (a) a polyimide resin having a specific structure, and (b) a crosslinking agent containing a tungsten group. |