abstract |
An object of the present invention is to provide an adhesive composition which can control the dispersibility of a thermally conductive filler, has high high thermal conductivity, is excellent in adhesion, and can alleviate thermal stress during a thermal cycle test, and the adhesive composition of the present invention contains (A) a soluble polyimine, (B) epoxy resin, and (C) a thermally conductive filler characterized by containing three kinds of diamine residues having a specific structure, and 100 parts by weight relative to (A) soluble polyimine The content of the (B) epoxy resin is 30 parts by weight or more and 100 parts by weight or less. |