| abstract |
A resin composition containing: (A) a polyimide resin containing 60 mol% or more of all diamine residues and having a diamine residue having a structure represented by the following general formula (1), (B) A resin composition of thermosetting resin and (C) thermally conductive filler, which is 100 parts by volume relative to the total of (A) polyimide resin, (B) thermosetting resin, and (C) thermally conductive filler , Containing more than 60 parts by volume of (C) thermally conductive filler. To provide a resin composition capable of obtaining a sheet having excellent heat resistance and thermal conductivity, a low modulus of elasticity, and excellent thermal responsiveness. |