| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 |
| filingDate |
2020-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a12b3e1ed4253e7bb6782495c9bbde47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fd396982571291ceb4307e5518a538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9ac9da62dbd89f7f9306efbf84c9a94 |
| publicationDate |
2020-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200115226-A |
| titleOfInvention |
Dicing tape with adhesive film |
| abstract |
In the expansion process performed using a dicing tape having an adhesive film in order to obtain a semiconductor chip having an adhesive film, it is suitable for good cutting of the adhesive film on the dicing tape (DT), and the adhesive film after cutting is A dicing tape having an adhesive film is provided which is suitable for realizing good pick-up in a pick-up process while suppressing lift-off from DT with respect to a semiconductor chip having a semiconductor chip. The dicing tape X having the adhesive film of the present invention includes a dicing tape 10 and an adhesive film 20. The adhesive film 20 is in close contact with the pressure-sensitive adhesive layer 12 of the dicing tape 10 so as to be peelable. For the peel adhesion between the adhesive layer 12 and the adhesive film 20 of the test piece subjected to UV irradiation of 300 mJ/cm 2 at 22°C, the adhesive layer 12 of the test piece subjected to UV irradiation of 300 mJ/cm 2 at 60°C The ratio of the peel adhesion between the adhesive films 20 is 0.8 to 2. |
| priorityDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |