| abstract |
The invention provides a resin composition which can be heat-cured at a temperature of about 80 ° C. and has excellent PCT resistance. Therefore, the resin composition is suitable as a liquid-type adhesive used in the manufacture of image sensor modules or electronic parts. The resin composition of the present invention is characterized by containing (A) an epoxy resin, (B) a compound represented by the following formula (1), (C) a hardening accelerator, (D) a silane coupling agent, and the aforementioned (B) component The content of the compound is based on the equivalent ratio of the epoxy group of the epoxy resin of the component (A) to the thiol group of the compound of the component (B): 1: 0.5 to 1: 2.5, and the silane couple of the component (D) The content of the mixture is 0.2 to 50 parts by mass based on 100 parts by mass of the total amount of the component (A), the component (B), the component (C), and the component (D). The equivalent ratio of thiol group to Si of the aforementioned (D) silane coupling agent is 1: 0.002 to 1: 1, |