abstract |
The present invention is an adhesive composition, which forms an adhesive composition for temporarily adhering a semiconductor substrate or an electronic device and an adhesive layer of a light-transmitting support, which contains (a) a light absorber, a polyisocyanate, and a polyisocyanate Alcohol, or (b) a light absorber, a urethane resin containing a polymerizable carbon-carbon unsaturated bond, and a polymerization initiator. |