| abstract |
The present invention is for providing a pressure-sensitive adhesive tape for protecting the surface of semiconductor parts which transfers little foreign matter to an object (part) to be adhered in a manufacturing process, the pressure-sensitive adhesive tape comprising at least a base material film, a pressure-sensitive adhesive layer, and a peeling liner, the base material film having the pressure-sensitive adhesive layer on one surface thereof, and the peeling liner using an unprocessed plastic film which does not contain a releasing layer being formed on the pressure-sensitive adhesive layer. |