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filingDate 2017-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108702845-B
titleOfInvention Method for manufacturing connection structure
abstract The invention provides a method for manufacturing a connection structure, which can perform low-temperature installation while increasing the allowable range of the terminal interval of a component. The method comprises the following steps: a disposing step of disposing a first electronic component having a first terminal row and a second electronic component having a second terminal row opposed to the first terminal row with a thermosetting anisotropic conductive adhesive having conductive particles interposed therebetween; a heat pressing step of heat pressing the first electronic component and the second electronic component so that the conductive particles are sandwiched between the first terminal row and the second terminal row; and a main curing step of irradiating the anisotropic conductive adhesive with infrared laser light in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row, and main curing the anisotropic conductive adhesive.
priorityDate 2016-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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