| abstract |
Disclosed is an adhesive composition for semiconductors, which contains a thermosetting resin (A) and a compound (B) having a sulfide bond represented by the formula (1) below and an alkoxysilyl group. -(S)n- (1) (In the formula (1), n represents an integer not less than 1.) A component represented by the formula (2) below is contained in the compound (B) in an amount of not more than 0.6% by mass. X-(CH2)m-SiR1R2R3 (2) (In the formula (2), R1-R3 independently represent an alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms, and at least one of R1-R3 is an alkoxy group having 1-10 carbon atoms; X represents a halogen atom; and m represents an integer of 1-10.) |