| abstract |
The invention is to provide an adhesive for connecting metals and resins, The adhesive comprises 0.0001~3 wt% of an amino silane, 0.0001~1wt% of a crosslinking reagent and 0.0001~3 wt% of an organometallic compound base on its total weight. In particular, the adhesive is to form an adhesive layer with an atomic ratio less 50% and apply in package process, such as advanced semiconductor package process. |