| abstract |
The present invention provides a bonding film and a tape for wafer processing which can improve mechanical strength and thermal cycle characteristics in a semiconductor device in which a semiconductor element and a substrate are bonded. A bonding film, characterized in that it is a bonding film (13) for bonding a semiconductor element (2) and a substrate (40), and has a conductive bonding layer (13a), the conductive bonding layer (13a) The conductive paste containing metal fine particles (P) is filled in the pores or meshes of the reinforcing layer containing a porous body or a mesh body. |