http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101208611-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05C5-0208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05C5-0204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2011-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b23b49d2b44af962bd40b50d28de360b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74fbbc2842370f064645e570e4b567b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234792aed488a3184cd233c4cd94bb06 |
| publicationDate | 2012-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101208611-B1 |
| titleOfInvention | Adhesive composition containing polyalkyl phenylene oxide resin which has epoxy end group, Lead lock tape for semiconductor packages using the same, and its manufacturing method |
| abstract | The present invention relates to an adhesive composition containing a polyalkylphenylene oxide resin having an epoxy end group, a lead lock tape for a semiconductor package using the same, and a method for producing the same. The adhesive composition of the present invention has epoxy groups at both ends of the polyphenylene oxide main chain in order to effectively introduce a polyphenylene oxide resin having a low dielectric constant and a low dielectric loss rate property into an adhesive composition containing an epoxy resin as a main component. By containing in the form of a bifunctional polyalkylphenylene oxide epoxy resin, to improve the compatibility with the epoxy resin to participate in the curing reaction to achieve a high cross-link density, by increasing the content of polyphenylene oxide, the present invention Since the adhesive tape for a semiconductor package manufactured using the adhesive composition of the adhesive layer has a low dielectric constant, a low dielectric loss rate, and a high glass transition temperature, electrical and thermal reliability between circuits is significantly increased. |
| priorityDate | 2011-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.