| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6943dc70fb5060800a393adfc6e5e06 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49524 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 |
| filingDate |
2019-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a838efb9f82357da28214670eba31d32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8de27274e584abc2893171e8c32be49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d703feca3f4fb26655e671a043287c38 |
| publicationDate |
2020-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200111309-A |
| titleOfInvention |
Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same |
| abstract |
The present technology can protect the lower surface of the semiconductor package and the plurality of protruding electrodes formed on the lower surface of the semiconductor package during the manufacturing process of a semiconductor package having a plurality of protruding electrodes, and can be easily removed from the semiconductor package after completing a predetermined manufacturing process. An adhesive tape for a semiconductor package manufacturing process that can be separated, comprising: an adhesive tape for a semiconductor package manufacturing process attached to a lower surface of a semiconductor package having a plurality of protruding electrodes formed thereon, comprising: a base layer having one surface treated; An adhesive layer formed on one surface of the base layer and containing silicon having a helical network structure; And it provides an adhesive tape comprising a release film containing fluorine adhered on the adhesive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11688716-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021358882-A1 |
| priorityDate |
2019-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |