Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1065 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 |
filingDate |
2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4adf91c530d69d331cec8437e2a380c8 |
publicationDate |
2017-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201739327-A |
titleOfInvention |
Manufacturing method of connecting structure |
abstract |
The present invention provides a method of manufacturing a bonded structure that can increase the allowable range of terminal spacing of components and perform low temperature mounting. The present invention has a step of disposing a first electronic component including a first terminal row and a first terminal row opposite to each other via a thermosetting anisotropic conductive adhesive having conductive particles. The second electronic component of the second terminal block; the hot pressing step of hot pressing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal block and the second terminal row; In the step of irradiating the infrared laser light with the conductive particles interposed between the first terminal block and the second terminal row, the anisotropic conductive adhesive is completely cured. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11414573-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I797225-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11355469-B2 |
priorityDate |
2016-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |