| abstract |
A dielectric-heating adhesive film capable of realizing a strong bonding in a relatively short time by performing a dielectric heating treatment on a polyolefin-based resin or the like as an adherend, and a bonding method using the same. A dielectric-heating adhesive film for bonding a plurality of adherends made of the same material or different materials by dielectric heating treatment, comprising: (A) a polyolefin resin; and (B) Wherein the dielectric filler contains a dielectric filler having an average particle size of 1 to 30 占 퐉 and a thickness of 10 to 2,000 占 퐉 and a bonding method using the same. |