| abstract |
The present invention provides an adhesive film capable of producing high-quality semiconductor devices in which voids disappear with good yield and the excessive extension of the adhesive film is suppressed, and uses thereof. The adhesive film of the present invention is used to embed the first semiconductor element fixed on the adherend, and fix the second semiconductor element different from the first semiconductor element to the adherend, and contains thermoplastic resin, heat Curable resin and inorganic filler, the content of inorganic filler in the total solid content is 30% by weight or more and 50% by weight or less, and the content of the thermoplastic resin in the total solid content is 10% by weight or more and 25% by weight or less , The viscosity at 120℃ before heat hardening is 1300 Pa·s or more and 4500 Pa·s or less. |