| abstract |
The present invention relates to an adhesive film, a dicing-wafer bonding film, a method of manufacturing a semiconductor device, and a semiconductor device. The present invention provides an adhesive film which can produce a high-quality semiconductor device with good yield, a method of manufacturing a semiconductor device using the same, and a semiconductor device obtained by the method. An adhesive film of the present invention, which is an adhesive film for embedding a first semiconductor element fixed on an adherend and fixing a second semiconductor element different from the first semiconductor element to an adherend, Among them, the adhesion strength to SUS at 40 ° C was 0.2 MPa or less. |