abstract |
PROBLEM TO BE SOLVED: To provide an adhesive film capable of manufacturing a high-quality semiconductor device with a high yield, a method for manufacturing a semiconductor device using the same, and a semiconductor device obtained by the manufacturing method. An adhesive film for embedding a first semiconductor element fixed on an adherend and fixing a second semiconductor element different from the first semiconductor element to the adherend, The thickness T is greater than the thickness T 1 of the first semiconductor element, the adherend and the first semiconductor element are connected by wire bonding, and the difference between the thickness T and the thickness T 1 is An adhesive film that is 40 μm or more and 260 μm or less, or that the adherend and the first semiconductor element are flip-chip connected, and the difference between the thickness T and the thickness T 1 is 10 μm or more and 200 μm or less. [Selection] Figure 1C |