| abstract |
A silicone adhesive film obtained by hydrosilylation, the B-stage, of a silicone composition comprising at least (A) an organopolysiloxane having a phenyl group and an alkenyl group, (B) an arbitrary diorganopolysiloxane having a phenyl group and an alkenyl group, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule thereof, (D) an adhesion promoter, and (E) a hydrosilylation catalyst. This B-stage silicone adhesive film softens readily and exhibits good gap-filling properties even in thermocompression bonding at relatively low temperature/pressure to an adherend having gaps on the surface thereof, and can harden and bond securely to the adherend. |