| abstract |
The invention provides an adhesive for mounting a semiconductor sensor chip that can reduce the perception of noise and improve the heat resistance and cold-heat cycle resistance characteristics. The adhesive for mounting a semiconductor sensor wafer according to the present invention is an adhesive for mounting a semiconductor sensor wafer, and includes a silicone resin and a spacer. The 10% compression modulus of the spacer is 10 N / mm. 2 or more and 2000 N / mm 2 or less, the compression recovery rate of the spacer is 20% or less, and the average particle diameter of the spacer is 10 μm or more and 200 μm or less. |