| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d0c5e62bc89d4a361b8a96ff2310e78 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2013-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c64d3ba84e558c709edac1b32e333fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e10341e91091fef0e49aafa7db0e8f54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3d0735e6491d2668b33d7bc5bc382f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_973300dc68f3d844c8904288626f37c4 |
| publicationDate |
2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101435613-B1 |
| titleOfInvention |
Composition for non-conductive film of having excellent light transmittance and non-conductive film including the same |
| abstract |
The present invention relates to a composition for a nonconductive adhesive film having improved light transmittance and a nonconductive adhesive film containing the same. More specifically, the present invention has remarkably improved light transmittance, thereby greatly improving workability and having a high glass transition temperature By exhibiting the heat resistance required for semiconductor products, it is suitable for use in semiconductor products, minimizes the occurrence of voids between bumps caused by tacky at room temperature, improves bump fillability, ensures bump bonding reliability, Conductive adhesive film having improved light transmittance that can be widely applied to various semiconductors and electric and electronic products including the same, as the wafer delamination is prevented. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101773711-B1 |
| priorityDate |
2013-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |