| abstract |
In a package mounted with a semiconductor chip that is becoming thinner, a thinner adhesive layer can be formed, which has excellent storage stability and high package reliability even when exposed to severe reflow conditions. The adhesive composition which can implement | achieve property, and the adhesive sheet which has an adhesive layer which consists of this adhesive composition. An adhesive composition comprising an epoxy thermosetting resin (A), a thermosetting agent (B), and a curing accelerator (C), wherein the curing accelerator (C) is methyl ethyl ketone. And a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive composition comprising the pressure-sensitive adhesive composition and a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition. [Selection figure] None |