| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 |
| filingDate |
2018-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110546735-B |
| titleOfInvention |
Semiconductor processing belt |
| abstract |
The invention provides a semiconductor processing belt which can be heated and contracted fully in a short time and can keep the width of a notch (kerf). The tape (10) for semiconductor processing is characterized by comprising an adhesive tape (15), wherein the adhesive tape (15) comprises a base material film (11) and an adhesive layer (12) formed on at least one surface side of the base material film (11), and the sum of the average value of the thermal deformation rates per 1 ℃ at a temperature of 40-80 ℃ measured by a thermomechanical property tester in the MD direction and the average value of the thermal deformation rates per 1 ℃ at a temperature of 40-80 ℃ measured by a thermomechanical property tester in the TD direction is a negative value. |
| priorityDate |
2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |