| abstract |
PROBLEM TO BE SOLVED: To cut off an adhesive film and a wafer into individual chips, to prevent re-adhesion of the adhesive film and the contact of the chip, to remove deflection, to be excellent in subsequent position recognition, and to be picked up well. A method for manufacturing a semiconductor device is provided. A wafer processing tape which is a laminate formed by laminating a dicing tape and a semiconductor wafer via an adhesive sheet and shrinks when heated after expansion, the dicing tape at −15 to 10 ° C. The elongation ratio is 110% or more, and after extending to 105% or more at −15 to 10 ° C., the area shrinks to 80% or less by heating to 100 ° C. or more, and the TD direction (width direction) ) And the shrinkage ratio in the MD direction (longitudinal direction) are 1.2 or less. A method for manufacturing a semiconductor device using an adhesive sheet and a dicing tape. [Selection] Figure 4 |