| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2015-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9303942b2fa3cc02ac01f9a28e38735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_903f1fad8cfee0cbae0a68db7d95cf3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11917d09d04db3b7bcf56f9a5fb8e818
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1393eb272ff531b0b3510828ef22f57 |
| publicationDate |
2017-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106574151-A |
| titleOfInvention |
Conductive Adhesive Film |
| abstract |
The present invention provides an adhesive film that is excellent in heat resistance and stress relaxation and can be obtained without using expensive precious metals such as silver and is applicable to a semiconductor processing method using the adhesive film. Due to the high conductivity of the back electrode of the power semiconductor, it will not protrude from the device and can obtain sufficient adhesive strength. Specifically, there is provided a conductive adhesive film comprising two or more metal particles containing at least Cu and a polymer having a polydimethylsiloxane skeleton. Also provided are a dicing die bonding film formed by laminating a dicing tape on the conductive bonding film, and a method of processing a semiconductor wafer using the adhesive film and the dicing die bonding film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109819657-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109819657-B |
| priorityDate |
2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |