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publicationDate 2004-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6790323-B2
titleOfInvention Self ionized sputtering using a high density plasma source
abstract A magnetron especially advantageous for low-pressure plasma sputtering or sustained self-sputtering having reduced area but full target coverage. The magnetron includes an outer pole face surrounding an inner pole face with a gap therebetween. The outer pole of the magnetron of the invention is smaller than that of a circular magnetron similarly extending from the center to the periphery of the target and has a substantially larger total magnetic intensity. Thereby, sputtering at low pressure and high ionization fraction is enabled.
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