| abstract |
A reactive sputtering apparatus includes a vacuum chamber, a cathode fixed to an inner surface of the chamber, a power source for applying a voltage to the cathode, a magnetic circuit, installed in the cathode and having magnets for generating a magnetic field, a target, installed adjacent the magnets, having an opening at a portion corresponding to a region between the magnets of the magnetic circuit, a vacuum device for evacuating air inside the chamber to obtain vacuum, a first gasintroducing device, disposed at a wall of the chamber, for supplying reactive gas into the chamber, a second gas-introducing device for supplying discharge gas from the opening of the target into the chamber, a first gas flow rate control device for controlling the supply of the reactive gas, a second gas flow rate control device for controlling the supply of the discharge gas, and a substrate holder, disposed in opposition to the target inside the chamber, for securing a substrate thereto. |