patent/US-5695810-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5695810-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad4ab3611e10f5b00a40797493451d66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a722744e77c81c5f5cf415087e2ee92b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-50
filingDate	1996-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1997-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa1c52760ce4843ab66e2b0c700c9347 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbfa5a75f51e5fd2ee0d7c3959cf80e3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e8079f693f4ab48b86d78fa10de6075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e4170a875099eaec0bd66e6c30640ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cd0ea16e1b9663839ecf887995a75e7
publicationDate	1997-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5695810-A
titleOfInvention	Use of cobalt tungsten phosphide as a barrier material for copper metallization
abstract	A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.
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Total number of triples: 854.