| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1c8866eec47ed946faf95065c5aa48e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9962e43d6e5760580ee7457bec3bf457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0d9b07d64ef0d28383bdccbe2cffe02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_18110b7cd33de01a14c16cb5550b8051 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02362 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2012-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c0ae32f02c82650e12fe70eb64e7937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61219871dde18571378607194cf7521a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3afb2fc4da5d428ba33464f28d6a764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_818925aa2f3ff9fb5dbe083f228881f3 |
| publicationDate |
2014-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8889546-B2 |
| titleOfInvention |
Discontinuous/non-uniform metal cap structure and process for interconnect integration |
| abstract |
A method of fabricating an interconnect structure is provided which includes providing a dielectric material having a dielectric constant of about 3.0 or less and at least one conductive material embedded therein, the at least one conductive material has an upper surface that is coplanar with an upper surface of the dielectric material; and forming a noble metal-containing cap directly on the upper surface of the at least one conductive material, wherein the noble metal cap is discontinuous or non-uniform. |
| priorityDate |
2008-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |