patent/US-2004262772-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004262772-A1

Outgoing Links

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filingDate	2003-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e211fa3cf8a20a995bcf6b64cffab60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1720cfac98f02c06dbe37a1b90e0dced http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3f2fcdfd96c899a1f5fbb1a0ba44f1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93d86a8588c0dabd0ce8729a5d48a56e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_149c5ae61ef0e2d4306c20e0398c7a86
publicationDate	2004-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2004262772-A1
titleOfInvention	Methods for bonding wafers using a metal interlayer
abstract	Embodiments of a method of bonding wafers together using a metal interlayer deposited on conductors of each wafer. Also disclosed is a wafer stack formed according to the method of wafer bonding using a metal interlayer.
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