| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_93d86a8588c0dabd0ce8729a5d48a56e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3d0a4add8d18d76311fd1fd1aa5cf9fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d77af6e2ea3446392de3498a035c6016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_60fb4ac037634e92ba94836e315bc34f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2001-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b10742b1a89355784d732221475768f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8515c373e126bc6d8cfb11162bf61bd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f4bb3044a41a919c16de2c1ff6fb51f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec3637a8b7437da3cdd3265fef4f4685 |
| publicationDate |
2002-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-02058135-A2 |
| titleOfInvention |
Interconnect structures and a method of electroless introduction of interconnect structures |
| abstract |
A method comprising introducing an interconnect structure in an opening through a dielectric over a contact point a point (120) a nd introducing a conductive shunt material (180) through a chemically-induced oxidation-reduction reaction. A method comprising introducing an interconnect structure in an opening through a dielectric over a contact point, introducing a conductive shunt material having an oxidation number over an exposed surface of the interconnect structure, and reducing the oxidation number of the shunt. An apparatus comprising a substrate comprising a device having contact point, a dielectric layer (130) overlying the device with an opening to the contact point (120), and an interconnect structure disposed in the opening comprising an interconnect material and a different conductive shunt material (180). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10323905-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7338585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012000685-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010025966-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7087104-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7087972-B1 |
| priorityDate |
2000-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |