| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f5e742320fb080c4696960e4aa56010
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10abb478490d2c007ff1b9832c29794b |
| publicationDate |
2004-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004259352-A1 |
| titleOfInvention |
Corrosion resistance for copper interconnects |
| abstract |
An embodiment of the invention is a method to reduce the copper corrosion of copper interconnects by forming 70 at least one conductive displacement plating layer on the copper interconnects. Another embodiment of the invention is a method to eliminate the copper corrosion of copper interconnects by forming 70 at least one conductive displacement plating layer on the copper interconnects. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7700477-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020173013-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005186794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7374621-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007181151-A1 |
| priorityDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |