Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68785 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
filingDate |
2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a3e0ec594791cbc1a72a2ef0ad9123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afe379d2d6ce25b05ef4b2005da32bc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6474a5d910fcf9547f72c283b7865f51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37745a15c1346747e00b92ec0f28f5cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd97ca957ec62a8f68b493c9c1eff69d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d234124be7e513dda348c4f8808368e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb9e8b55c9a87c45440ae7105a77e124 |
publicationDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11276590-B2 |
titleOfInvention |
Multi-zone semiconductor substrate supports |
abstract |
Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume. |
priorityDate |
2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |