patent/US-6616967-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6616967-B1

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filingDate	2002-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf83419515c56ca724bfa94e2ba192e5
publicationDate	2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6616967-B1
titleOfInvention	Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process
abstract	An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.
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