| abstract |
A material containing, as a main component, an organic silicon compound represented by the following general formula: n n R.sup.1.sub.x Si(OR.sup.2).sub.4-x n n (where R 1 is a phenyl group or a vinyl group; R 2 is an alkyl group; and x is an integer of 1 to 3) is caused to undergo plasma polymerization or react with an oxidizing agent to form an interlayer insulating film composed of a silicon oxide film containing an organic component. As the organic silicon compound where R 1 is a phenyl group, there can be listed phenyltrimethoxysilane or diphenyldimethoxysilane. As the organic silicon compound where R 1 is a vinyl group, there can be listed vinyltrimethoxysilane or divinyldimethoxysilane. |