| abstract |
A set ( 50 ) of one or more laser pulses ( 52 ) is employed to remove passivation layer ( 44 ) over a conductive link ( 22 ). The link ( 22 ) can subsequently be removed by a different process such as chemical etching. The duration of the set ( 50 ) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse ( 52 ) within the set ( 50 ) is preferably within a range of about 0.05 ps to 30 ns. The set ( 50 ) can be treated as a single “pulse” by conventional laser positioning systems ( 62 ) to perform on-the-fly material removal without stopping whenever the laser system ( 60 ) fires a set ( 50 ) of laser pulses ( 52 ) at each target area ( 51 ). Conventional wavelengths in the IR range or their harmonics in the green or UV range can be employed. |