Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
filingDate |
2013-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c276a997ef97792881bc568c666e00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c1abb4654607c7168977a6b8a758791 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb73e35036bd94df6f7f95bb1ea7c23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e40db5e946ab757811e932831edecb5 |
publicationDate |
2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9105710-B2 |
titleOfInvention |
Wafer dicing method for improving die packaging quality |
abstract |
In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe and subsequent plasma etch is implemented for die singulation while also removing an oxidation layer from metal bumps on the wafer. In one embodiment, a method includes forming a mask over the semiconductor wafer covering the plurality of ICs, the plurality of ICs including metal bumps or pads with an oxidation layer. The method includes patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the ICs. The method includes plasma etching the semiconductor wafer through the gaps in the patterned mask to singulate the plurality of ICs and remove the oxidation layer from the metal bumps or pads. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015162305-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9646951-B2 |
priorityDate |
2013-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |