| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3086 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2016-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a3cc961a4fd0b08e2990202f18ceb8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_936679d18e1c3ac72234c22ba0004f9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d20730bb1754f48e1ac88926dc11acff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef6cbb71261e25d1d02435b2b3138bb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d44d073fd68554e33e7243b991d1a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec |
| publicationDate |
2017-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9793132-B1 |
| titleOfInvention |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process |
| abstract |
Etch masks and methods of dicing semiconductor wafers are described. In an example, an etch mask for a wafer singulation process includes a water-soluble matrix based on a solid component and water. The etch mask also includes a plurality of particles dispersed throughout the water-soluble matrix. The plurality of particles has an average diameter approximately in the range of 5-100 nanometers. A ratio of weight % of the solid component to weight % of the plurality of particles is approximately in the range of 1:0.1-1:4. |
| priorityDate |
2016-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |