| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7bfd706326ccfc1a7727e0d815a1780f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aaffc067902782a0853d687a002b8fb8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00415c6954d50881130756342023f349 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-46 |
| filingDate |
2013-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c02dc6144ce3d356ce4cbb4d89fd4ce3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11d5a0ba970ae491a14b4b868e8a9882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e953b16929c2fcd9816bac029c3787b |
| publicationDate |
2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9460966-B2 |
| titleOfInvention |
Method and apparatus for dicing wafers having thick passivation polymer layer |
| abstract |
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a front surface having a plurality of integrated circuits thereon involves forming a mask layer above the front surface of the semiconductor wafer. The method also involves laser scribing the mask layer and the front surface of the semiconductor wafer to provide scribe lines in the mask layer and partially into the semiconductor wafer. The laser scribing involves use of a dual focus lens to provide a dual focus spot beam. The method also involves etching the semiconductor wafer through the scribe lines to singulate the integrated circuits. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2686119-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11769738-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11056443-B2 |
| priorityDate |
2013-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |