patent/US-5575885-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5575885-A

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06
filingDate	1994-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1996-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6709afbafd4f6483486bb9c4c6168b61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba8730f0993ddf1f975e1a362b332d78
publicationDate	1996-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5575885-A
titleOfInvention	Copper-based metal polishing solution and method for manufacturing semiconductor device
abstract	Disclosed is a copper-based metal polishing solution which hardly dissolves a Cu film or a Cu alloy film when the film is dipped into the solution, and has a dissolution velocity during polishing several times higher than that during dipping. This copper-based metal polishing solution contains at least one organic acid selected from aminoacetic acid and amidosulfuric acid, an oxidizer, and water.
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