| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0604f61b441cfa327ae159f93987c91a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-19 |
| filingDate |
2009-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_698f0c3186e1fde9affaf14b2be61b02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613c91f6b63cc26e9fd0e2ebe7dc35ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9eedb330a65883b52cd94cdf32421e5 |
| publicationDate |
2011-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7972485-B2 |
| titleOfInvention |
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| abstract |
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate. |
| priorityDate |
2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |