patent/US-6726823-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6726823-B1

Outgoing Links

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filingDate	1999-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2004-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8af2e5fd981887deaf2ba884d52e45e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5cb2d261e88838a3f3c54b587253845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42195aadcd10e155aef5835923274191
publicationDate	2004-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6726823-B1
titleOfInvention	Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
abstract	A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
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priorityDate	1998-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 134.