| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D99-00 |
| filingDate |
2007-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b8b103cba30fd7e7bc8857e4fc7d576
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b23fd7a7860a7797279de6e0e4a96d3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1febad08d51559727fa0711cabe73c3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c0d397151895f942f54d8e959b23035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32f5ff9d9fe4f7bd96098f8aff75b6b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3812b701d883ae8a20d95d110caf0394 |
| publicationDate |
2010-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7709382-B2 |
| titleOfInvention |
Electroprocessing profile control |
| abstract |
Embodiments of the present invention provide methods of electroprocessing a substrate. One embodiment of the present invention provides a method comprises pressing a substrate against a polishing pad with a force less than about two pounds per square inch, the substrate contacting a first electrode of the polishing pad, applying an electrical bias to the substrate with the first electrode relative to a second electrode of the polishing pad, wherein the second electrode is disposed below the second electrode, and biasing a third electrode disposed in the polishing pad radially outward of the second electrode. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11491605-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020384602-A1 |
| priorityDate |
2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |