| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00 |
| filingDate |
2002-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b23fd7a7860a7797279de6e0e4a96d3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3eed43673a420c9170a9ae3625deae8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3812b701d883ae8a20d95d110caf0394
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_259dd58266d7a94a55907e2d7970acc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b8b103cba30fd7e7bc8857e4fc7d576 |
| publicationDate |
2003-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-536450-B |
| titleOfInvention |
Conductive polishing article for electrochemical mechanical polishing |
| abstract |
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7655565-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7709382-B2 |
| priorityDate |
2001-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |