| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-349 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2002-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d1195b2e831a4a1fec7e9f60fda4a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_262ca05fd767897b183df76accce6cda
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_581dc3975345bb7cef9ca6af0efccf3e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_715d615561275704eee5c8679c55ac20 |
| publicationDate |
2005-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6884338-B2 |
| titleOfInvention |
Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| abstract |
The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006208322-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005009714-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010006428-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7524410-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7972485-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214359-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006249397-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048756-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048287-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006234604-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009255806-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007111641-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7700436-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8101060-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7670466-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007037490-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008045009-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005056550-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11193059-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005020192-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8603319-B2 |
| priorityDate |
2002-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |