| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-06 |
| filingDate |
2003-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26b106bab26259be9d861e7313ecc159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac907d82b51b47b195b7dcadf64de759
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2eda68b64cf1fdf3e9ba13bb097cce3 |
| publicationDate |
2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7112122-B2 |
| titleOfInvention |
Methods and apparatus for removing conductive material from a microelectronic substrate |
| abstract |
A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or less. The substrate can be contacted with a polishing pad material, and the conductive material can be electrically coupled to a source of varying electrical signals via the electrolytic liquid and the electrode. The method can further include applying a varying electrical signal to the conductive material, moving at least one of the polishing pad material and the substrate relative to the other, and removing at least a portion of the conductive material while the electrolytic liquid is adjacent to the conductive material. By limiting/controlling the amount of water in the electrolytic liquid, an embodiment of the method can remove the conductive material with a reduced downforce. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008041725-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7935242-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009255806-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8101060-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048756-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048287-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011203940-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8603318-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214359-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8603319-B2 |
| priorityDate |
2003-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |